SAE AMS3690 Adhesive Compound, Epoxy, Room Temperature Curing
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Product Code:SAE AMS3690
Title:Adhesive Compound, Epoxy, Room Temperature Curing
Issuing Committee:Ams P Polymeric Materials Committee
Scope:This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 85 degrees C (185 degrees F), but usage is not limited to such applications.
Title:Adhesive Compound, Epoxy, Room Temperature Curing
Issuing Committee:Ams P Polymeric Materials Committee
Scope:This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 85 degrees C (185 degrees F), but usage is not limited to such applications.
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